Fine Pitch Probe Card
Specifications
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Components / Rings
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Rings /Spider Material:
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Ceramic, Aluminum, or Composite Materials
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Probe Materials:
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Tungsten, Rhenium Tungsten, Beryllium Copper,
Palladium
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Testing Temperature:
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25C to 165C
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Probe Diameter:
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3 mils to 6 mils
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Tip Diameter:
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0.5 mils to 1 mil
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Tip Shape:
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Flat, Semi-Radius, Radius
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Tip Length:
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6 mils to 25 mils
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Contact Resistance:
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2.0 Ohms
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Edge Sensors:
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2 Wire (Left or Right Hand), 2 or 3 Wire Isolated
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Devices
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Device Types:
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Logic, Mixed Signal, Memory, LCD
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Pad:
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Single, Dual & Triple Staggered, Dual-Inline
Row
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Pad Pitch / Size:
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Pitch > 30um; Width > 25um; Length >
45um
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Pad Material:
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Gold Pads, Gold Bumps, Aluminum, Copper, or
Industry Standard
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Assembly
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Alignment:
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+/- 0.25 mils
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Planarity:
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+/- 0.25 mils
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Probe Depth:
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80 mils to 150 mils (or build to customer
specification)
Measured from bottom of PCB
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Contact Force:
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0.8 to 1.5 gm/mil
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Epoxy:
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11 mils (Measured from probe tip to closest
epoxy surface)
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Edge Sensor Setting:
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On with first probe +/- 0.2mils
Off
with last probe +/- 0.2mils
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Theta Orientation:
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0 +/- 0.5 degrees
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