Cantilever Probe Card
Specifications
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Components / Rings
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Rings /Spider Material:
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Ceramic, Aluminum, or Composite Materials.
(Design per customer specifications)
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Probe Materials:
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Tungsten, Rhenium Tungsten, Beryllium Copper, NewTek, or Paliney7
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Testing Temperature:
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25C to 165C
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Probe Diameter:
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3 mils to 15 mils
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Tip Diameter:
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0.5 mils to 10 mils
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Tip Shape:
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Flat, Semi Radius, Full Radius
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Tip Length:
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7 mils (or Build to customer specifications)
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Contact Resistance:
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2.0 ohms
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Edge Sensors:
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2 Wire (Left or Right Hand), 2 or 3 wire
Isolated
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Devices
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Device Types:
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Logic, Mixed Signal, Memory, LCD
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Pad:
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Single, Staggered, DRI
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Pad Pitch / Size:
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Pitch: > 60u; Width: >
55u; Length: > 70u
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Pad Material:
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Gold Pads, Gold Bumps, Aluminum, Copper (or
Industry Standard)
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Assembly
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Alignment:
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+/- 0.3 mils
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Planarity:
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+/- 0.3 mils
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Probe Depth:
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80 mils to 400 mils (or
Build to Customer Spec.)
(Measured from Tip to Bottom of PCB)
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Contact Force:
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0.8 - 3.0 G/mils O.D.
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Epoxy:
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11 mils (Measured from tip to closest epoxy
surface)
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Edge Sensor Setting:
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On with First Probe +/- 0.2 mils; Off with Last
Probe +/- 0.2 mils
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Theta Orientation:
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0º (+/- 0.5º)
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