A complete solution for the semiconductor industry
Fine Pitch Probe CardOur customers are continuing to create ICs with denser architecture, smaller bond pads, reduced pad pitch, underlying circuitry, and new low-K materials, for which ProbeLogic has a solution. In addition to our standard Cantilever probe cards that can probe bond pad pitches down to 60 microns, we have developed our Fine Pitch/Low-k probe card for bond pad pitches down to 30 microns. We have been able to take the once difficult and impossible dilemma of testing today's complex ICs and made it possible for our customers. With our far superior 3-D modeling, FEA Analysis, proprietary build equipment, manufacturing process, and use of quality probe needles, we are able to provide a solution that is robust, decreases scrub marks, provides superior contact, and is reliable at higher test temperatures. Benefits of the Fine Pitch Probe Card
In order to determine if the Fine Pitch probe card will work for your company, please check out our detailed specifications. If you would like additional information on the Fine Pitch probe card as well as our other products and services, please complete the information request form. |
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