ProbeLogic has developed ways to advance the manufacturability and increase the performance of the cantilever probe card. It is the most durable and the highest quality probe card on the market. By utilizing internally developed manufacturing processes, ProbeLogic is able to provide test solutions for either single row or staggered die pad configuration and high-density devices. In addition to our proprietary manufacturing processes and build equipment, we use 3-D modeling and numerical analysis design software to evaluate each and every design. This combination allows us to reduce lead times to our customers and provide a service to them that no other company can match.
Cantilever Probe Card
Test solutions for both single or staggered row die pad configuration and high density devices.
|Fine Pitch Cantilever Probe Card
Test solutions for ICs with denser architecture, smaller bond pads, reduced pad pitch, and new low-k materials.
|Multi-DUT Diagonal Cantilever Probe Card
Test solutions for customers who require increased throughput and decreased test time
|G-Probe™ RF Cantilever Probe Card
Test solutions for mixed signal devices requiring RF bandwidth in excess of 3GHz
|Low Leakage Parametric Testing Solutions
Test solutions for low leakage parametic testing using robust and reliable cantilever technology.